Displays with delamination stopper and corrosion blocking structures

ABSTRACT

A display may have contacts that mate with a flexible printed circuit. The contacts may be used in providing data and control signals to pixels. A metal layer may be patterned to form metal traces for signal lines that extend outwardly towards an edge of the display from the contacts. Delamination stopper structures may be formed along the periphery of the display to inhibit delamination between layers of material on the display. The delamination stopper structures may be formed from bent portions of the metal traces, a slot-shaped inorganic layer opening that runs perpendicular to the metal traces, and a segmented trench in an organic layer. A corrosion blocker structure may be formed by creating metal trace gaps in the metal traces that are each bridged by a pair of vias that are shorted together using transparent conductive material such as a pair of indium tin oxide layers.

This application claims the benefit of provisional patent applicationNo. 62/576,994, filed Oct. 25, 2017, which is hereby incorporated byreference herein in its entirety.

FIELD

This relates generally to electronic devices with displays, and, moreparticularly, to structures for protecting displays from damage.

BACKGROUND

Electronic devices often include displays. During use of an electronicdevice, the electronic device may be subjected to drop events and otherimpact events. These events may generate high levels of stress. A devicemay also be exposed to environmental contaminants such as moisture. Ifcare is not taken, layers of material in a display may delaminate whenexposed to high stress or metal traces in the display may becomecorroded when exposed to moisture.

SUMMARY

A display may have layers such as a thin-film transistor layer, a liquidcrystal layer, and a color filter layer. Pixels may be formed from thelayers of the display. Electrical contacts for providing data andcontrol signals to the pixels may be formed from metal traces on thethin-film transistor layer. The thin-film transistor layer may alsoinclude organic and inorganic dielectric layers.

The metal traces may form signal lines that extend outwardly towards anedge of the display from the contacts and inwardly to the pixels.Delamination stopper structures may be formed along the periphery of thedisplay to inhibit delamination between layers of material on thethin-film transistor layer. The delamination stopper structures may beformed from bent portions of the metal traces, a slot-shaped opening inthe inorganic layer that runs perpendicular to the signal lines, and asegmented trench in the organic layer.

A corrosion blocker structure may be formed in each metal trace bycreating a metal trace gap in the metal trace that is bridged by a pairof vias that are shorted together using transparent conductive materialsuch as a pair of indium tin oxide layers.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an illustrative electronic device havinga display in accordance with an embodiment.

FIG. 2 is a schematic diagram of an illustrative electronic devicehaving a display in accordance with an embodiment.

FIG. 3 is a cross-sectional side view of an illustrative display inaccordance with an embodiment.

FIG. 4 is a cross-sectional side view of a portion of a thin-filmtransistor layer in a display in accordance with an embodiment.

FIG. 5 is a perspective view of an illustrative array of contacts on theend of a flexible printed circuit in accordance with an embodiment.

FIG. 6 is a top view of an edge portion of an illustrative display withan array of contacts to be bonded to the contacts of the flexibleprinted circuit of FIG. 5 in accordance with an embodiment.

FIGS. 7 and 8 are cross-sectional side views of illustrativedelamination stoppers in a display in accordance with embodiments.

FIG. 9 is a cross-sectional side view of an illustrative corrosionblocking structure for a display in accordance with an embodiment.

FIG. 10 is a top view of the corrosion blocking structure of FIG. 9 inaccordance with an embodiment.

DETAILED DESCRIPTION

An illustrative electronic device of the type that may be provided witha display is shown in FIG. 1. Electronic device 10 may be a computingdevice such as a laptop computer, a computer monitor containing anembedded computer, a tablet computer, a cellular telephone, a mediaplayer, or other handheld or portable electronic device, a smallerdevice such as a wrist-watch device, a pendant device, a headphone orearpiece device, a device embedded in eyeglasses or other equipment wornon a user's head, or other wearable or miniature device, a computerdisplay that does not contain an embedded computer, a computer displaythat includes an embedded computer, a gaming device, a navigationdevice, an embedded system such as a system in which electronicequipment with a display is mounted in a kiosk or automobile, equipmentthat implements the functionality of two or more of these devices, orother electronic equipment. In the illustrative configuration of FIG. 1,device 10 is a portable device such as a cellular telephone, mediaplayer, tablet computer, watch or other wrist device, or other portablecomputing device. Other configurations may be used for device 10 ifdesired. The example of FIG. 1 is merely illustrative.

In the example of FIG. 1, device 10 includes a display such as display14 mounted in housing 12. Housing 12, which may sometimes be referred toas an enclosure or case, may be formed of plastic, glass, ceramics,fiber composites, metal (e.g., stainless steel, aluminum, etc.), othersuitable materials, or a combination of any two or more of thesematerials. Housing 12 may be formed using a unibody configuration inwhich some or all of housing 12 is machined or molded as a singlestructure or may be formed using multiple structures (e.g., an internalframe structure, one or more structures that form exterior housingsurfaces, etc.).

Display 14 may be a touch screen display that incorporates a layer ofconductive capacitive touch sensor electrodes or other touch sensorcomponents (e.g., resistive touch sensor components, acoustic touchsensor components, force-based touch sensor components, light-basedtouch sensor components, etc.) or may be a display that is nottouch-sensitive. Capacitive touch screen electrodes may be formed froman array of indium tin oxide pads or other transparent conductivestructures. A touch sensor may be formed using electrodes or otherstructures on a display layer that contains a pixel array or on aseparate touch panel layer that is attached to the pixel array (e.g.,using adhesive).

Display 14 may include an array of pixels 22. The array of pixels indisplay 14 may form an active area such as active area AA of FIG. 1 inwhich images are displayed for a user. One or more edges of active areaAA may be bordered by an inactive area that is free of pixels such asinactive areas IA. Borderless designs for display 14 and arrangements inwhich active area AA is bordered only on two sides by inactive areas IAmay be used, if desired.

Pixels 22 may be formed from any suitable display pixel structures.Configurations in which display 14 is a liquid crystal display with abacklight and pixels 22 form an array of liquid crystal display pixelsare sometimes described herein as an example. This use of liquid crystaldisplay technology for forming display 14 is merely illustrative.Display 14 may, in general, be formed using any suitable type of pixels.

Display 14 may be protected using a display cover layer such as a layerof transparent glass or clear plastic. Openings may be formed in thedisplay cover layer. For example, an opening may be formed in thedisplay cover layer to accommodate a button, a speaker port, or othercomponent. Openings may be formed in housing 12 to form communicationsports (e.g., an audio jack port, a digital data port, etc.), to formopenings for buttons, etc.

FIG. 2 is a schematic diagram of device 10. As shown in FIG. 2,electronic device 10 may have control circuitry 16. Control circuitry 16may include storage and processing circuitry for supporting theoperation of device 10. The storage and processing circuitry may includestorage such as hard disk drive storage, nonvolatile memory (e.g., flashmemory or other electrically-programmable-read-only memory configured toform a solid state drive), volatile memory (e.g., static or dynamicrandom-access-memory), etc. Processing circuitry in control circuitry 16may be used to control the operation of device 10. The processingcircuitry may be based on one or more microprocessors, microcontrollers,digital signal processors, baseband processors, power management units,audio chips, application specific integrated circuits, etc.

Input-output circuitry in device 10 such as input-output devices 18 maybe used to allow data to be supplied to device 10 and to allow data tobe provided from device 10 to external devices. Input-output devices 18may include buttons, joysticks, scrolling wheels, touch pads, key pads,keyboards, microphones, speakers, tone generators, vibrators, cameras,sensors (e.g., ambient light sensors, proximity sensors, orientationsensors, magnetic sensors, force sensors, touch sensors, pressuresensors, fingerprint sensors, etc.), light-emitting diodes and otherstatus indicators, data ports, etc. A user can control the operation ofdevice 10 by supplying commands through input-output devices 18 and mayreceive status information and other output from device 10 using theoutput resources of input-output devices 18. Input-output devices 18 mayinclude one or more displays such as display 14.

Control circuitry 16 may be used to run software on device 10 such asoperating system code and applications. During operation of device 10,the software running on control circuitry 16 may display images ondisplay 14 using an array of pixels in display 14. While displayingimages, control circuitry 16 may control the transmission of each of thepixels in the array and can make adjustments to the amount of backlightillumination for the array that is being produced by backlightstructures in display 14.

Display 14 may have a rectangular shape (i.e., display 14 may have arectangular footprint and a rectangular peripheral edge that runs aroundthe rectangular footprint) or may have other suitable shapes. Display 14may be planar or may have a curved profile.

A cross-sectional side view of display 14 is shown in FIG. 3. As shownin FIG. 3, display 14 may include backlight structures such as backlightunit (backlight) 42 for producing backlight such as backlightillumination 44. During operation, backlight illumination 44 travelsoutwards (vertically upwards in dimension Z in the orientation of FIG.3) and passes through display pixel structures in display layers 46.This illuminates any images that are being produced by the displaypixels for viewing by a user. For example, backlight illumination 44 mayilluminate images on display layers 46 that are being viewed by viewer48 in direction 50.

Display layers 46 may be mounted in chassis structures such as a plasticchassis structure and/or a metal chassis structure to form a displaymodule for mounting in housing 12 or display layers 46 may be mounteddirectly in housing 12 (e.g., by stacking display layers 46 into arecessed portion in housing 12). Display layers 46 may form a liquidcrystal display or may be used in forming displays of other types.

In a liquid crystal display, display layers 46 may include a liquidcrystal layer such a liquid crystal layer 52. Liquid crystal layer 52may be sandwiched between display layers such as display layers 58 and56. Layers 56 and 58 may be interposed between lower polarizer layer 60and upper polarizer layer 54.

Layers 58 and 56 may be formed from transparent substrate layers such asclear layers of glass or plastic. Layers 58 and 56 may be layers such asa thin-film transistor layer and/or a color filter layer. Conductivetraces, color filter elements, transistors, and other circuits andstructures may be formed on the substrates of layers 58 and 56 (e.g., toform a thin-film transistor layer and/or a color filter layer). Touchsensor electrodes may also be incorporated into layers such as layers 58and 56 and/or touch sensor electrodes may be formed on other substrates.

With one illustrative configuration, layer 58 may be a thin-filmtransistor layer that includes an array of pixel circuits based onthin-film transistors and associated electrodes (pixel electrodes) forapplying electric fields to liquid crystal layer 52 and therebydisplaying images on display 14. Layer 56 may be a color filter layerthat includes an array of color filter elements for providing display 14with the ability to display color images. If desired, layer 58 may be acolor filter layer and layer 56 may be a thin-film transistor layer.Configurations in which color filter elements are combined withthin-film transistor structures on a common substrate layer in the upperor lower portion of display 14 may also be used.

During operation of display 14 in device 10, control circuitry (e.g.,one or more integrated circuits on a printed circuit) may be used togenerate information to be displayed on display 14 (e.g., display data).The information to be displayed may be conveyed to one or more displaydriver integrated circuits such as illustrative circuit 62 using asignal path such as a signal path formed from conductive metal traces ina rigid or flexible printed circuit such as printed circuit 64 (as anexample). Signal paths in printed circuit 64 may also form connectionswith control circuits (e.g., integrated circuits forming controlcircuitry 16 on one or more additional printed circuits).

Thin-film transistor layer 58 may have metal traces that form signallines (e.g., data lines, gate lines, clock signal lines, power supplypaths, etc.). These signal lines may be coupled to metal traces such ascontacts 70 (sometimes referred to as thin-film transistor layercontacts, display contacts, electrical contacts, or pads). Each contact70 may be electrically coupled to a corresponding contact 72 on flexibleprinted circuit 64. Signal lines in printed circuit 64 may be used incoupling contacts 72 to circuitry in display driver circuit 62 and/orother circuitry in device 10. Anisotropic conductive film 74 or otherelectrical coupling structures may be used in electrically couplingcontacts 70 in display 14 to corresponding flexible printed circuitcontacts (pads) such as contacts 72 on flexible printed circuit 76. Film74 may include conductive particles in a polymer binder. When contacts72 are pressed towards contacts 70, portions 78 of film 74 will becompressed sufficiently that the conductive particles in portions 78will form electrical connections between respective contacts 70 and 72.Less compressed portions of film 74 such as portions 76 will remaininsulating. In this way, flexible printed circuit 64 may be attached todisplay 14 to convey signals between circuit 62 and pixels 22 on layer58.

When device 10 is dropped (e.g., on its end), flexible printed circuit64 may be pressed in direction 80, causing end portion 64E of flexibleprinted circuit 64 to be forced in upwards direction 82. This may causedelamination among the thin-film layers on layer 58 that are coupled tofilm 74. Thin-film delamination can damage display 14 and cause display14 to fail or become vulnerable to environmental contamination. Toprevent delamination and corrosion along the edge of display 14,peripheral portions of display 14 can be provide with delaminationstopper structures and corrosion blocking structures. These structuresmay be formed, for example, in inactive area IA along the border ofpixels 22.

In active area AA, pixels 22 may be formed from thin-film transistorcircuitry in layer 58. As an example, each pixel 22 may have atransistor such as transistor 84 of FIG. 4. Transistors such astransistor 84 may be formed from semiconductor layers, dielectriclayers, and metal layers in thin-film transistor circuitry (layer) 88 onsubstrate 100 in layer 58. One of the source-drain terminals of eachtransistor 84 may be coupled to pixel electrodes 98F using conductivevia layer 98. Dielectric layer 96 may be interposed between electrodes(electrode fingers) 98F and common voltage (Vcom) electrode 94. Duringoperation, transistor 84 may be used in controlling the voltage appliedto electrodes 98F and therefore used in controlling the electric fieldthrough an associated portion of liquid crystal layer 52 (FIG. 3). Topermit backlight illumination 44 to pass through pixel 22, theconductive layer that forms electrodes 98F and via layer 98 and theconductive layer that forms common voltage electrode 94 may be formedfrom a transparent conductive material such as indium tin oxide. Thethickness of each of these two indium tin oxide layers may be about50-100 nm, at least 10 nm, less than 500 nm, or other suitablethickness. In inactive area IA, the layers of indium tin oxide may beused in forming corrosion blocker structures for display 14. Inactivearea IA may also include delamination stopper structures that inhibitdelamination among the thin-film layers of display 14.

FIG. 5 is a bottom perspective view of an illustrative flexible printedcircuit end portion 64E for flexible printed circuit 64. As shown inFIG. 5, flexible printed circuit 64 may have a series of contacts 72(e.g., conductive pads). Contacts 72 may have rectangular shapes orother suitable shapes. The length L of each contacts 72 may be 100-300microns, at least 50 microns, less than 500 microns, or other suitablelength. The pitch (center-to-center spacing) between adjacent contacts72 may be about 30-50 microns, at least 10 microns, less than 60microns, or other suitable pitch. The width perpendicular to length L ofeach contact 72 may be about 10-50 microns, at least 5 microns, at least20 microns, less than 40 microns, or other suitable width. In theexample of FIG. 5, there is a single row of contacts 72 on flexibleprinted circuit 64. If desired, multiple staggered rows of contacts 72may be provided.

Illustrative delamination stopper (blocking) structures for display 14are shown in the top view of the illustrative edge portion of thin-filmtransistor layer 58 of display 14 of FIG. 6. As shown in FIG. 6,thin-film transistor layer 58 may be formed from a substrate such assubstrate 100. Metal traces 108 form signal lines that couple contacts72 to the thin-film circuitry of active area AA (e.g., pixels 22) andthat extend outwardly to respective test pads 104 on substrate 100.Traces 108 may have a thickness of 0.3 microns, at least 0.1 microns,less than 0.5 microns, or other suitable thickness. Duringmanufacturing, probes in test equipment form electrical contacts withpads 104 and are used in testing display 14. After satisfactory testing,substrate 100 is cut along cut line 102 (e.g., by scribing-and-breakingtechniques, sawing, etc.). This removes test pad portion 106 ofsubstrate 100 from the remainder of substrate 100, thereby trimmingthin-film transistor layer 58 to its desired final shape (e.g., a shapethat minimizes that size of inactive border region IA). After flexibleprinted circuit 64 is coupled to thin-film transistor layer 58 by film76, signals from flexible printed circuit 64 may be conveyed tocircuitry in pixels 22 using metal traces 108 at locations 110 that arecoupled to contacts 72. In some configurations, contacts 72 may have viaportions such as vias 72V for coupling the conductive material ofcontacts 72 to metal traces 108. Corrosion blocking structures formedfrom vias may also be interposed in metal traces 108.

Thin-film transistor layer 58 may have structures that preventdelamination between the thin-film layers that form the thin-filmtransistor circuitry layer on substrate 100. These delamination stopperstructures may include, for example, metal trace delamination stopperportions 108DL in metal traces 108. As shown in FIG. 6, portions 108DLof traces 108 may have bends that help prevent any delamination that isoccurring at the outer edge of layer 58 from propagating inward indirection 114. In particular, bent portions 108DL may have one or morebends characterized by a bend angle A of less than 90°, less than 80°,less than 50°, at least 20°, at least 35°, or other suitable bend angle.Sharp bends (e.g., bends that cause some of trace 108 to reverse course)may help prevent any delamination that is initiated in direction 114from propagating past the bend. In this way, portions 108DL serve asmetal trace delamination stopper structures.

Another type of delamination stopper structure that may be used alongthe edge of thin-film transistor layer 58 is delamination stopper trench116. Trench 116 may penetrate through a planarization layer (e.g., apolymer planarization layer PLN), one or more inorganic dielectriclayers (e.g., an interlayer dielectric layer ILD), and/or otherthin-film layers on the surface of substrate 100. Trench 116 may runperpendicular to metal traces 108 (e.g., parallel to the adjacent edgeof thin-film transistor layer 58). To prevent trench 116 from exposingmetal traces 108 to moisture, trench 116 may be segmented and have aseries of gaps 120, each of which is sufficiently wide to allow arespective one of metal traces 108 to pass. Configurations in whichtrench 116 is not segmented may also be used in forming delaminationstopper structures.

The thin-film layers that cover the surface of substrate 100 inthin-film transistor layer 58 may include an inorganic dielectric layersuch as silicon nitride layer 96 of FIG. 4. This layer may delaminatefrom the other layers on substrate 100 when stress is applied. Toprevent delamination from propagating inwardly in direction 114, layer96 may be provided with a strip-shaped opening such as opening 122. Thisslot-shaped opening may extend parallel to the edge of layer 58 and mayoverlap each of traces 108. If delamination of layer 96 is initiated atthe edge of layer 56 and begins to propagate inwardly in direction 114,the absence of layer 96 in the gap formed from opening 122 will helpdecouple the inner portion of layer 96 from the delaminated outerportion of layer 96 and thereby prevent layer 96 from delaminatingfurther.

FIG. 7 is a cross-sectional side view of layer 58 of FIG. 6 taken alongline 130 and viewed in direction 132. As shown in FIG. 7, layer 58 mayinclude dielectric layers such as dielectric buffer layer 130 (e.g.,inorganic dielectric layer(s) such as silicon oxide and/or siliconnitride) and gate insulator layer 132 (e.g., a layer of silicon oxide orother inorganic dielectric). Metal trace 108 may be formed from apatterned metal layer on a layer of dielectric such as one or more oflayers 130, 132, etc. Portions 108DL of trace 108 may form delaminationstopper structures, as described in connection with FIG. 8. Metal layer140 may form a conductive via layer for via 72V. Transparent conductivelayers such as indium tin oxide layers 142 and 144 may also formconductive layers for via 72V and may be shorted to each other and tometal layer 140.

Contact 72 may be formed from rectangular conductive structures (e.g.,transparent conductive structures) such as rectangular patches formedfrom lower indium tin oxide layer 142 and upper indium tin oxide layer144. Using metal layer 104 and layers 142 and 144, via 72V mayelectrically couple the conductive structures of contact 72 to metaltrace 108 through interposed dielectric layers such as interlayerdielectric layer 134 and planarization layer 136. Layer 134 may includeone or more inorganic dielectric layers and may have an overallthickness of about 0.4-0.7 microns, at least 0.3 microns, less than 0.8microns, or other suitable thickness. Planarization layer 136 may be anorganic dielectric layer such as a polymer layer with a thickness of 2-3microns, at least 1 micron, less than 4 microns, or other suitablethickness.

A protective coating layer such as silicon nitride layer 138 or otherinorganic dielectric layer may cover planarization layer 136. Layer 138may have a thickness of 100-200 nm, at least 75 nm, less than 300 nm, orother suitable thickness. As described in connection with FIG. 6,opening 122 (e.g., a strip-shaped opening that extends into the page inthe orientation of FIG. 7, perpendicular to the signal lines formed frommetal traces 108) may serve as a delamination stopper structure byhelping to prevent further inward propagation of any delamination thatis taking place between layer 138 and layer 136 at the edge of layer 58(e.g., at cut line 102).

FIG. 8 is a cross-sectional side view of layer 58 of FIG. 6 taken alongline 150 and viewed in direction 152. As shown in FIG. 8, trench 116 mayextend through layers 136 and 134 and may serve as an additionaldelamination stopper structure that further hinders the inwardpropagation of any delamination among the layers of layer 58 (e.g.,delamination between layer 132 and/or delamination between other layersin layer 58).

FIG. 9 is a cross-sectional side view of an illustrative corrosionblocker structure 72CB that may be used in layer 58. Corrosion blockerstructure 72CB of FIG. 9 includes vias 72V1 and 72V2 and otherconductive structures formed from metal layer 140 and indium tin oxidelayers or other transparent conductive layers 142 and 144. The presenceof structure 72CB can help prevent ingress of corrosion from exposure tomoisture or other environmental contaminants. Structure 72CB of FIG. 9may form a contact such as contact 72 of FIG. 6 that mates with aflexible printed circuit contact or may be interposed elsewhere alongthe length of metal trace 108. Metal trace 108 may have a metal tracegap such as gap 108G that separates a first portion of trace 108 (outerportion 108A) from a second portion of trace 108 (inner portion 108B).Due to the presence of gap 108G, corrosion cannot progress inwardlyalong trace 108 past gap 108G. Vias 72V1 and 72V2 are shorted togetherby layers 142 and 144 and form a conductive path between portions 108Aand 108B. This path bridges gap 108G and shorts portions 108A and 108Btogether. As a result, portions 108A and 108B are electrically connectedwhile being physically disconnected at gap 108G, thereby allowingsignals to pass along metal trace 108 during testing and/or normaloperation. The indium tin oxide in layers 142 and 144 is resistant tocorrosion damage upon exposure to moisture, so layers 142 and 144 areless sensitive to moisture than metal trace 108. This helps ensure thatlayers 142 and 144 of shorted vias 72V1 and 72V2 will not be corrodedand will remain conductive while preventing corrosion from progressingpast gap 108G.

FIG. 10 is a top view of illustrative corrosion blocker structures 72CBof FIG. 9. In this illustrative configuration for layer 58, delaminationstopper structures such as trench 116, opening 122, and portions 108DLof trace 108 are interposed between the outer edge of layer 58 (e.g.,the edge of substrate 100 formed by cut line 102) and corrosion blockerstructures 72CB (and pixels 22 of active area AA). Structures 72CB mayform a contact (see, e.g., contact 72 of FIG. 6) or may be interposedbetween the outer edge of layer 58 and contact 72. In the example ofFIG. 10, portion 108DL is interposed between structure 72CB and opening122. Opening 122 is interposed between trench 116 and portion 108DL. Inthe example of FIG. 6, trench 116 is interposed between opening 122 andportion 108DL. Other illustrative configurations may be used for formingdelamination stopper structures (portion 108DL, trench 116, and/oropening 122) and/or corrosion blocker structures such as structure 72CB.The configurations of FIGS. 6 and 10 are merely illustrative.

The foregoing is merely illustrative and various modifications can bemade to the described embodiments. The foregoing embodiments may beimplemented individually or in any combination.

What is claimed is:
 1. A display, comprising: pixels that are configuredto display images, wherein the pixels are formed using layers on asubstrate, wherein the layers on the substrate are configured to formcontacts, and wherein the substrate has an edge; a flexible printedcircuit configured to bond to the contacts; metal traces that formsignal lines that extend respectively between each of the contacts andthe edge; and delamination stopper structures between the contacts andthe edge that are configured to inhibit delamination in the layers,wherein the delamination stopper structures include an opening with aslot shape in at least one layer in the layers and wherein the openingextends at a non-zero angle from the metal traces.
 2. The displaydefined in claim 1 wherein the delamination stopper structures includeportions of the metal traces with bends.
 3. The display defined in claim2 wherein the layers include an inorganic dielectric layer and whereinthe opening is the inorganic dielectric layer.
 4. The display defined inclaim 3 wherein the opening runs perpendicular to the metal traces. 5.The display defined in claim 4 wherein the layers include an organicdielectric layer and wherein the inorganic dielectric layer is formed onthe organic dielectric layer.
 6. The display defined in claim 5 whereinthe delamination stopper structures include a trench.
 7. The displaydefined in claim 6 wherein the trench is formed in at least the organicdielectric layer and runs parallel to the opening.
 8. The displaydefined in claim 7 wherein the trench is segmented and has a series ofgaps.
 9. The display defined in claim 8 wherein each of the metal tracespasses through a respective one of the gaps in the trench.
 10. Thedisplay defined in claim 9 wherein each metal trace has a metal tracegap that separates a first portion of that metal trace from a secondportion of that metal trace.
 11. The display defined in claim 10 furthercomprising transparent conductive material that electrically shorts thefirst portion to the second portion in each metal trace.
 12. The displaydefined in claim 11 wherein the transparent conductive material includesfirst and second layers of indium tin oxide.
 13. The display defined inclaim 12 further comprising, for each metal trace, first and second viasthat are shorted to each other using the transparent conductivematerial, wherein the first via is shorted to the first portion of thatmetal trace and wherein the second via is shorted to the second portionof that metal trace.
 14. The display defined in claim 1 wherein eachmetal trace has a metal trace gap that is bridged by a corrosion blockerstructure having first and second vias that are shorted to each other.15. The display defined in claim 14 further comprising at least onelayer of transparent conductive material that is included in the firstand second vias and that shorts the first via to the second via.
 16. Adisplay, comprising: pixels that are configured to display images,wherein the pixels are formed using layers on a substrate, wherein thelayers on the substrate are configured to form contacts and wherein thesubstrate has an edge; anisotropic conductive film; a flexible printedcircuit bonded to the contacts with the anisotropic conductive film;metal traces, wherein each metal trace extends between a respective oneof the contacts and the edge, wherein the delamination stopperstructures include portions of the metal traces that bend at an acuteangle; and delamination stopper structures between the contacts and theedge that are configured to inhibit delamination in the layers.
 17. Thedisplay defined in claim 16 further comprising corrosion blockerstructures interposed in each metal trace.
 18. The display defined inclaim 17 wherein the layers include an organic layer and an inorganiclayer on the organic layer and wherein the delamination stopperstructures include an opening in the inorganic layer and a trench in theorganic layer.
 19. The display defined in claim 18 wherein the corrosionblocker structures include first and second vias coupled respectively tofirst and second portions of each metal trace that are separated by ametal trace gap.
 20. A display with contacts configured to bond to aflexible printed circuit using anisotropic conductive film, comprising:pixels that are configured to display images, wherein the pixels areformed using first and second layers and a layer of liquid crystalmaterial between the first and second layers, wherein the first layer isa thin-film transistor layer having thin-film transistor circuitryformed on a substrate, wherein the substrate has an edge, and whereinthe thin-film transistor circuitry is formed from a plurality of layersof material including an organic dielectric layer, an inorganicdielectric layer, and at least one metal layer configured to form signallines that extend from the contacts to the edge of the substrate; anddelamination stopper structures between the contacts and the edge thatare configured to inhibit delamination in the layers of material,wherein the delamination stopper structures include bent portions of thesignal lines, an opening in the inorganic dielectric layer, and a trenchin the organic dielectric layer.